IC Packaging Simulation Engineer
Santa Clara Valley (Cupertino),California,United States
+ Solid training in mechanics and mathematics.
+ Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
+ Familiar with numerical simulation software tools. Expert programmer of Matlab and/or Scientific Python.
+ Deep understanding of packaging materials and their mechanical behaviors.
+ Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
+ Able to perform independent research and development work
+ Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings
You will work on: â€¢Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. â€¢Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.
**Education & Experience**
â€¢PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.
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