IC Packaging Simulation Engineer

Apple

Cupertino, CA 95015

Posted 1 month ago

Job Description

IC Packaging Simulation Engineer


Santa Clara Valley (Cupertino),California,United States


Hardware


+ Solid training in mechanics and mathematics.


+ Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).


+ Familiar with numerical simulation software tools. Expert programmer of Matlab and/or Scientific Python.


+ Deep understanding of packaging materials and their mechanical behaviors.


+ Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.


+ Able to perform independent research and development work


+ Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings


**Description**


You will work on: •Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. •Programming CAD tools, FEM software, and numerical tools to set up automated model-generation user interfaces and maintain those codes.


**Education & Experience**


•PhD degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics or related fields.


**Additional Requirements**


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