RF Packaging Architect â€“ SIP Module
Santa Clara Valley (Cupertino),California,United States
+ Position requires at least 5+ years experience in System Architecture and Design, Packaging Design, Heterogeneous System Integration, and SIP Module Development.
+ Strong knowledge of circuits, schematics, engineering requirements and device specifications.
+ Proficient with schematic capture tools (Concept preferred) and PCB/package layout tools.
+ Experience with RF SOC bring up is preferred.
+ Knowledge of Signal Integrity and Power Integrity.
+ Strong engineering physics including packaging electrical, electro-magnetic, thermal, and mechanical interactions.
+ Knowledge of packaging structures and mechanical constraints.
+ Ability to work with cross functional teams and drive initiatives.
+ Strong communication skills.
+ Strong critical thinking and problem solving skills.
Work with system teams to identify opportunities for innovative RF system integration. Align with system teams on future requirements and constraints, develop roadmaps and identify SIP module packaging schemes and constructions to meet requirements.
**Education & Experience**
Masters in Electrical Engineering or Physics and relevant experience within technical discipline.
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